AI Server
BG18-A10710
產品特色
Single AMD EPYC™ 9006 series Server CPUs, LGA7536 socket, up to 600W
16x DDR5 RDIMMs/MRDIMMs, up to 8000/12800MT/s
2x PCIe Gen6 x16 slots for SW FHFL GPUs
8x E1.S Gen6 SSDs bays, 2x M.2 2280 M Key slots
Modular DC-SCM2 form factor equipped with Aspeed AST2700 BMC
(1+1) 2700W 80+ Titanium redundant power supplies
16x DDR5 RDIMMs/MRDIMMs, up to 8000/12800MT/s
2x PCIe Gen6 x16 slots for SW FHFL GPUs
8x E1.S Gen6 SSDs bays, 2x M.2 2280 M Key slots
Modular DC-SCM2 form factor equipped with Aspeed AST2700 BMC
(1+1) 2700W 80+ Titanium redundant power supplies
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Cloud -
Edge AI -
Storage
Built for next-generation validation and AI infrastructure development, this server leverages a 2P-DLC direct liquid cooling solution to support high-density CPU and GPU workloads with superior thermal efficiency. It enables AI model prototyping, HPC benchmarking, and system integration validation, while ensuring stable performance, reduced thermal constraints, and optimized power efficiency for advanced data center and edge deployment scenarios.
Power Supply
Configuration
(1+1) 2700W Redundant Power Supplies
Rating
80+ Titanium Efficiency
Form Factor
Form Factor
1U Rackmount Chassis
Dimensions (WxHxD)
438mm (W) x 43.2mm (H) x 900mm (D)
Processor
CPU Socket
Single-socket AMD EPYC™ “Venice” (LGA7536)
CPU Support
AMD EPYC™ 9006 series Server CPUs, up to 600W
GPU Support
Max GPU Count
2x Single-Width, up to 600W
Interconnect
FHFL PCIe Gen6 x16 slots
System Momery
DIMM Slots
16 DIMM Slots
Type
DDR5 RDIMM/MRDIMM
Speed (MT/s)
RDIMM up to 8000 MT/s(1DPC)
MRDIMM up to 12800 MT/s(1DPC)
MRDIMM up to 12800 MT/s(1DPC)
Drive Bays
Front Bays
8x Hot-swap E1.S PCIe 6.0 x4 NVMe
Internal Bays
2x M.2 2280 PCIe 4.0 x2 NVMe (OS drive)
Expanstion Slots
Default Config
2x FHFL PCIe Gen6 x16 slots dedicated for GPUs
(2-Phase DLC cold plate for GPU cards)
1x OCP 3.0 slot
(2-Phase DLC cold plate for GPU cards)
1x OCP 3.0 slot
Input / Output
Management
1x 1000Base-T dedicated port via DC-SCM
USB / Display
1x USB 3.0 (Front)
1x UART (USB form factor) (Front)
1x Mini DP (Rear)
1x UART (USB form factor) (Front)
1x Mini DP (Rear)
System Cooling
Air Cooling
High-performance heavy-duty fans with optimal speed control algorithms
Liquid Cooling
2P-DLC solution(CPU & GPU)
System BIOS
BIOS Type
AMI UEFI BIOS
Management
BMC
Integrated Aspeed AST2700 BMC
Protocol
IPMI 2.0, Redfish, and web-based GUI
Monitoring
Real-time monitoring of CPU/GPU temperatures, fan speeds, and system health
ROT
ROT via AST1060
Weight
Net Weight
Approx. 18-28 kg (depending on configuration)
Operating Environment
Temperature
0°C to 35°C (32°F to 95°F)
Humidity
8% to 90% non-condensing
Note
Designed for standard enterprise data center environments.
